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| Push Switch Surface Mount Type Push Switch SPEF Series Surface mountable lead-free soldering push switch. Typical Specifications Items Rating (max) (Resistive load) Initial contact resistance Operating force Operating life Without load Poles-Positions Specifications Push 1A 14.5V DC Detector Slide 100 3N,5N 30,000cycles 1-pole,2-positions Rotary Encoders Power Dual-in-line Package Type Product Line Changeover timing Travel mm Total travel Operating mm force 3N Non shorting 1.5 2.7 5N PC board Latching TACT SwitchTM Mounting method Operating Terminal type Reflow Dip Reflow Dip Minimum order unit pcs. 1,320 2,100 1,320 2,100 Drawing Product No. No. SPEF210101 SPEF110100 SPEF210200 SPEF110200 CustomProducts Taping Specifications (Taping Packaging) Reel Size Unit:mm Number of packages pcs. 1 reel 1 case /Japan 1 case /export packing Tape width mm Horizontal Type Vertical Type 165 o380 33.5 660 1,320 32 Note Please place purchase orders per minimum order unit (integer). 105 Push Switch Surface MountType Push Switch SPEF Series Dimensions No. Reflow Soldering Type Detector Push Slide Rotary 2.1 4.6 Terminal No. C 2 1.2 Terminal No.1 Terminal No.2 2.1 Unit:mm Style PC board mounting hole dimensions 14.3 9.5 6 3.7 0.3 11.3 9 3.5 2.5 2.5 2.5 A Power Dual-in-line Package Type TACT SwitchTM CustomProducts 1 13.6 9.4 3.5 2.5 Full stroke position Lock position 1.8 6.9 11.86 13.1 14.6 Terminal No.1 Terminal No.2 Encoders 1.2 6 Dip Soldering Type Horizontal Type Vertical Type Terminal No. C 1.3 1.4 0.9 6.7 12.2 9.8 A 9.4 3.5 2.5 9 3.5 2.5 2.5 2.5 6 4- 2- hol 1.3 e ho 1.5 le hol e 1 .6 Full stroke position Lock position 2 5.7 6.7 7.4 8.85 12 1 1 .1 6.7 1. .1 ho le ole 6h 11.86 13.1 14.6 6.9 ho le 3.2 3.5 1 5.7 6.7 1 1.2 o1.4 6 9.8 12.2 o0.9 PC board mounting face Circuit Diagram Viewed from Direction A 1 C 2 106 1.3 Push Switches List of Varieties Series SPPH4 SPPH1 SPEC SPED2 SPED3 SPED4 SPED5 SPEF Photo Detector Push Travel mm Total travel mm Number of poles W Dimensions mm D H Operating temperature range Rating max. Resistive load Rating min. Resistive load Initial contact resistance Insulation resistance Voltage proof Terminal strength Operating direction Pulling direction Electrical performance Mechanical performance Durability Environmental performance 2.2 3 1.5 2.5 2 2.5 3.4 4.5 3.8 1 12 10 16.8 12.5 26.7 40C to 14 18 20.7 85C 13.5 18.2 1.5 2.7 Slide Rotary Encoders 8.5 6.5 8.5 10C to 60C 10 9.4 9 6.9 Power Dual-in-line Package Type TACT SwitchTM CustomProducts 0.1A 30V DC 1A 14.5V DC 50BA 3V DC 100m max. 100M 20m max. 30m max. 3M 100m min. 500V DC 100V AC for 1minute max. 3M min. 100V DC min. 500V DC 500V AC for 1minute 5N for 1minute 30N 3N for 1minute 50N Horizontal Type 90N Vertical Type Actuator strength 10N 50N 30N Operating life without load Operating life without load Load:as rating Cold Dry heat Damp heat Manual soldering Dip soldering Reflow soldering Page 10,000cycles 100m max. 10,000cycles 40m max. 10,000cycles 50m max. 30,000cycles 100m max. -20 2 for 96h 85 40 2 2 for 96h -40 2 for 96h , 90 to 95%RH for 96h 350 10 3 0.5s 260 5 10 1s 350 5 3s max. 260 5 10 1s Please see P.108 350 10 3 1s 0 260 5 5 1s 260 5 10 1s 350 10 3 0.5s 260 max. 260 5 10 1s 5s max. Notes 1. 2. 3. Applicable to SPED220200 PC board type only. 4. Applicable to SPEF110100 only. Soldering 98 99 101 102 103 105 83 Push Switches Soldering Conditions Example of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2 Detector Push Slide Rotary Encoders Power Dual-in-line Package Type TACT SwitchTM CustomProducts Series Reflow type SPEE 260 230 40 180 150 120 CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement. 3. Temperature profile 300 Temperature (C ) A max. B 200 D E 100 Time (s) Pre-heating F max. C Room temperature A 3s max. B Cs D E Fs SPEF, SPEG Notes Horizontal Type Vertical Type 1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. 108 |
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